Han-Chung Lai

Title: Han-Chung Lai: Innovator in Semiconductor Technology

Introduction

Han-Chung Lai is a prominent inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of wafer processing. With a total of 2 patents to his name, Lai continues to push the boundaries of innovation in his field.

Latest Patents

Lai's latest patents include a method for edge and bevel CMP of copper wafers. This innovative approach provides a new method to edge and bevel the periphery of a semiconductor substrate. The wafer is positioned in a horizontal plane and held in place against two positioning pegs. The wafer is rotated, and slurry is distributed over the periphery of the substrate surface. The periphery of the wafer is then entered into one or more abrasive fixtures, also referred to as bevel/edge heads. These fixtures create the desired edge and bevel around the periphery of the substrate.

Another notable patent is a method for using ultrasound to assist in forming conductive layers on substrates. This invention provides three embodiments to deposit layers over a substrate using ultrasound energy to vibrate the substrate during various processes, including PVD or CVD deposition, annealing, and plating deposition. The ultrasonic energy allows for more conformal layer deposition over opening sidewalls and decreases overhangs and voids.

Career Highlights

Han-Chung Lai is affiliated with the Industrial Technology Research Institute, where he has been instrumental in advancing semiconductor technologies. His work has garnered attention for its innovative approaches and practical applications in the industry.

Collaborations

Lai collaborates with various professionals in his field, including his coworker Hung-Wen Chiou. Their combined expertise contributes to the ongoing development of cutting-edge technologies in semiconductor processing.

Conclusion

Han-Chung Lai is a key figure in semiconductor innovation, with a focus on improving wafer processing techniques. His patents reflect a commitment to advancing technology and enhancing the efficiency of semiconductor manufacturing.