Asan, South Korea

Hak Jun Kim

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hak Jun Kim. Retrieved from https://idiyas.com/inventor/hak-jun-kim-u3cvuidv

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2021

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1 patent (USPTO):Explore Patents

Title: Hak Jun Kim - Innovator in Printed Circuit Board Technology.

Introduction

Hak Jun Kim is a notable inventor based in Asan, South Korea. He has made significant contributions to the field of electronics, particularly in the development of printed circuit boards and semiconductor packages.

Latest Patents

Hak Jun Kim holds a patent for a printed circuit board and semiconductor package that includes a base layer with opposing surfaces. The design features a first structure on the first surface of the base layer, which includes a first plate structure and a first connection structure. The first plate structure is equipped with first openings, some of which are linear openings that enhance the functionality of the circuit board.

Career Highlights

Hak Jun Kim is currently employed at Samsung Electronics Co., Ltd., a leading company in the technology sector. His work focuses on advancing electronic components that are essential for modern devices.

Collaborations

He has collaborated with notable coworkers, including Jung Ho Park and In Won O, contributing to innovative projects within the company.

Conclusion

Hak Jun Kim's work in printed circuit board technology exemplifies the innovative spirit of modern electronics. His contributions continue to influence the industry and pave the way for future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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