The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 02, 2021
Filed:
Feb. 11, 2020
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 25/065 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0278 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H05K 1/111 (2013.01); H01L 25/0657 (2013.01);
Abstract
A printed circuit board that includes a base layer having a first surface and a second surface opposing each other. A first structure is disposed on the first surface of the base layer. The first structure includes a first plate structure. A first connection structure is disposed on a same plane as the first plate structure and is spaced apart from the first plate structure. The first plate structure includes first openings. At least some of the first openings are linear openings having a line shape.
Park, Jung. (2021). Printed circuit board and semiconductor package including the same (U.S. Patent No. 11166368). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11166368
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile