Tokyo, Japan

Hajime Kumatani

This inventor holds 1 USPTO granted patent. Top assignee: Mitsubishi Heavy Industries Limited. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hajime Kumatani. Retrieved from https://idiyas.com/inventor/hajime-kumatani

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Hajime Kumatani: Innovator in Thickness Measurement Technology

Introduction

Hajime Kumatani is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of measurement technology, particularly in the area of thickness measurement for heat transfer pipes. His innovative approach has led to the development of a unique measuring method that utilizes advanced eddy-current probe technology.

Latest Patents

Kumatani holds 1 patent for his invention titled "Scale thickness measuring method." This method involves measuring the thickness of attachments on the outer surface of a heat transfer pipe using an eddy-current probe equipped with an excitation coil and detection coils. The process includes setting a reference point, moving the probe, and calculating the thickness based on a calibration curve derived from the drift amount.

Career Highlights

Hajime Kumatani is currently employed at Mitsubishi Heavy Industries Limited, where he continues to work on innovative solutions in engineering and technology. His expertise in measurement techniques has positioned him as a valuable asset to his organization.

Collaborations

Kumatani has collaborated with esteemed colleagues such as Kentaro Jinno and Masaaki Kurokawa. Their combined efforts contribute to the advancement of technology in their respective fields.

Conclusion

Hajime Kumatani's work in thickness measurement technology exemplifies the spirit of innovation. His contributions not only enhance the efficiency of heat transfer systems but also reflect the importance of collaboration in driving technological advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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