The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2025
Filed:
May. 19, 2022
Mitsubishi Heavy Industries, Ltd., Tokyo, JP;
Kentaro Jinno, Tokyo, JP;
Masaaki Kurokawa, Tokyo, JP;
Hajime Kumatani, Tokyo, JP;
Yuji Kohashi, Tokyo, JP;
MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo, JP;
Abstract
A measuring method of measuring a thickness of attachments attached to an outer peripheral surface of a heat transfer pipe by using an eddy-current probe, which is provided with an excitation coil and a pair of detection coils, the method including: obtaining a point in which the difference becomes zero is set as a reference point in a region to which the attachments is not attached by calculating a difference between the axial and circumferential components of the magnetic field detected by the pair of detection coils; moving the eddy-current probe inside the heat transfer pipe in the direction of the axis; calculating the difference between the axial and circumferential components of the magnetic field; obtaining a drift amount by comparing the difference with the reference point; and calculating the thickness of the attachments from a calibration curve obtained in advance on the basis of the drift amount.