This inventor holds 1 USPTO granted patent. Top assignee: At&s (China) Co. Ltd.. Active years: 2021.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2021
Title: Haina Wu - Innovator in Component Carrier Manufacturing
Introduction
Haina Wu is a notable inventor based in Peixian, China. He has made significant contributions to the field of manufacturing, particularly in the area of component carrier materials. His innovative approach has led to the development of a unique method that enhances the efficiency of manufacturing processes.
Latest Patents
Haina Wu holds a patent for a method titled "Manufacturing holes in component carrier material." This method involves providing an electrically conductive layer structure on top of an electrically insulating layer structure. It includes forming a window in the electrically conductive layer structure and removing material of the electrically insulating layer structure below the window by a first laser beam. Subsequently, further material of the electrically insulating layer structure below the window is removed by a second laser beam, which has a smaller size than the size of the window. This innovative technique showcases his expertise in utilizing laser technology for manufacturing applications. He has 1 patent to his name.
Career Highlights
Haina Wu is currently employed at AT&S (China) Co. Ltd., a leading company in the field of advanced technology and manufacturing solutions. His work at AT&S has allowed him to apply his inventive skills in a practical setting, contributing to the company's reputation for innovation and quality.
Collaborations
Haina Wu has collaborated with talented coworkers, including Seok Kim Tay and Abderrazzaq Ifis. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.
Conclusion
Haina Wu is a distinguished inventor whose work in manufacturing holes in component carrier materials has made a significant impact in the industry. His innovative methods and collaborations with skilled professionals highlight his commitment to advancing technology. His contributions continue to shape the future of manufacturing processes.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile