This inventor holds 2 USPTO granted patents and 2 EPO patents. Top assignee: Stratasys, Inc.. Active years: 2022-2025.
Company Filing History:
Years Active: 2022-2025
Title: Haim Rotfeld: Innovator in Additive Manufacturing
Introduction
Haim Rotfeld is a notable inventor based in Mazkeret Batya, Israel. He has made significant contributions to the field of additive manufacturing, holding 2 patents that showcase his innovative approach to technology.
Latest Patents
One of Haim Rotfeld's latest patents is a method and system for additive manufacturing using closed-loop temperature control. This system includes a dispensing head for dispensing building materials on a working surface, a hardening system for solidifying the materials, and a cooling system designed to evacuate heat from the building materials. A computerized controller manages these components, while a thermal sensing system is strategically mounted above the working surface to allow for relative motion. This sensing system generates signals based on the thermal energy it detects. The controller is responsible for controlling the dispensing head to layer the building materials, generating sensing signals only when the sensing system is positioned above the hardened materials, and adjusting the cooling system's heat evacuation rate based on the sensing signals.
Career Highlights
Haim Rotfeld is currently employed at Stratasys, Inc., a leading company in the field of 3D printing and additive manufacturing. His work at Stratasys has allowed him to further develop his innovative ideas and contribute to advancements in the industry.
Collaborations
Haim has collaborated with notable coworkers such as Amit Feffer and Gil Shelef, who share his passion for innovation in additive manufacturing.
Conclusion
Haim Rotfeld's contributions to additive manufacturing through his patents and work at Stratasys, Inc. highlight his role as a key innovator in the field. His advancements in technology continue to influence the industry and pave the way for future developments.
