This inventor holds 1 USPTO granted patent. Top assignee: Aac Microtech (Changzhou) Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Hailiang Gui: Inventor of a Speaker Module Housing
Introduction
Hailiang Gui is an inventor associated with Changzhou, China. His patent work includes a design for a speaker module housing intended to reduce the risk of shrinkage in the housing’s front shell.
Latest Patents
The provided information identifies one patent associated with Gui: Speaker Module Housing and Speaker Module. The invention includes a front shell with an accommodating cavity and a back cover attached over that cavity. It also features a plastic structure integrally injection-molded with the front shell and positioned in the gate region, the fixed region, or both.
The design gives the front shell additional plastic thickness in these regions. This helps extend the effective holding time during shrinkage and reduces the risk of shrinkage in the fixed region. Gui is credited with 1 patent.
Career Highlights
Gui is associated with AAC Microtech (Changzhou) Co., Ltd. His patent reflects work on speaker-module construction and injection-molding design, with a focus on improving the housing’s manufacturing characteristics.
Collaborations
The provided information lists Jie Yuan and Siyuan Ni as Gui’s coworkers. It does not specify their roles in the patent or the extent of their collaboration.
Conclusion
Hailiang Gui’s identified patent addresses a practical manufacturing challenge in speaker-module housings by using an integrally molded plastic structure to help reduce shrinkage risk.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile