The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2026

Filed:

Feb. 07, 2024
Applicant:

Aac Microtech (Changzhou) Co., Ltd., Changzhou, CN;

Inventors:

Hailiang Gui, Changzhou, CN;

Jie Yuan, Changzhou, CN;

Siyuan Ni, Changzhou, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 1/02 (2006.01);
U.S. Cl.
CPC ...
H04R 1/025 (2013.01);
Abstract

Speaker module housing and speaker module, the speaker module housing includes front shell with accommodating cavity and back cover fixed to front shell and covering accommodating cavity. Front shell has gate region for injection molding and fixed region opposite to gate region and away from gate region. Thickness of part of front shell between gate region and fixed region is smaller than thickness of fixed region. Speaker module housing further includes plastic structure fixed in accommodating cavity. Plastic structure and front shell are integrally injection-molded, and plastic structure is located in gate region and/or fixed region. Plastic structure is arranged in gate region and/or fixed region of front shell, so that part of front shell located in gate region and fixed region has sufficient plastic thickness, which extends effective holding time of shrinkage position of front shell and reduce risk of shrinkage in fixed region of front shell.


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