Malacca, Malaysia

Hai Sin Chong

This inventor holds 1 USPTO granted patent. Top assignee: Infineon Technologies Ag. Active years: 2019.


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2019

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1 patent (USPTO):Explore Patents

Title: Innovations of Hai Sin Chong in Semiconductor Technology

Introduction

Hai Sin Chong is a notable inventor based in Malacca, Malaysia. He has made significant contributions to the field of semiconductor technology, particularly through his innovative designs and patents. His work has been instrumental in advancing the efficiency and functionality of semiconductor packages.

Latest Patents

One of Hai Sin Chong's key patents is for a molded semiconductor package with C-wing and gull-wing leads. This patent describes a semiconductor package that includes a semiconductor die embedded in a molded package body. The design features leads that are electrically connected to the die and protrude from a side face of the molded package body. A unique aspect of this invention is a recess that extends inward from the side face into the bottom main face of the molded package body, forming a single groove. This recess begins below the region of the side face from which the leads protrude, ensuring that this area remains flat and that each lead exits the molded package body in the same plane. A first subset of the leads is bent inward towards the molded package body and seated in the single groove, creating a first row of leads configured for surface mounting. Meanwhile, a second subset of the leads extends outward from the molded package body, forming a second row of leads also configured for surface mounting. This innovative design enhances the performance and reliability of semiconductor packages.

Career Highlights

Hai Sin Chong is currently employed at Infineon Technologies AG, a leading company in semiconductor solutions. His role at Infineon has allowed him to further develop his expertise and contribute to cutting-edge technologies in the semiconductor industry. With a total of 1 patent to his name, he continues to push the boundaries of innovation in his field.

Collaborations

Throughout his career, Hai Sin Chong has collaborated with several talented individuals, including Cher Hau Danny Koh and Stefan Machiener. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of innovative solutions.

Conclusion

Hai Sin Chong's contributions to semiconductor technology exemplify the impact of innovation in the industry. His patented designs not only enhance the functionality of semiconductor packages but also pave the way for future advancements. His work at Infineon Technologies AG and collaborations with fellow inventors highlight the importance of teamwork in driving technological progress.

Profile summary based on public USPTO records.
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