Infineon Technologies Ag

Hai Sin Chong

Khay Chwan Saw

Toni Salminen

Cher Hau Danny Koh

Yong Chern Poh

Stefan Machiener

A semiconductor package includes a semiconductor die embedded in a molded package body, leads electrically connected to the die and protruding from a side face of the molded package body, and a recess extending inward from the side face and into a bottom main face of the molded package body to forma single groove. The recess begins below a region of the side face from which the leads protrude, so that this region of the side face is flat and each of the leads exits the molded package body in the same plane. A first subset of the leads is bent inward towards the molded package body and seated in the single groove, to form a first row of leads configured for surface mounting. A second subset of the leads extends outward from the molded package body, to form a second row of leads configured for surface mounting.

Growing community of inventors

Melaka, Malaysia

Hai Sin Chong