Hai-Jun Zhao

Title: Innovations of Hai-Jun Zhao

Introduction

Hai-Jun Zhao is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique patent that enhances the efficiency of stacked semiconductor devices.

Latest Patents

Hai-Jun Zhao holds a patent for a "Stacked semiconductor device and method." This patent describes a method of stacking wafers that includes several steps. It involves providing a first wafer with a first metal connection layer, forming a first passivation layer over this connection layer, and creating a first bondpad in the passivation layer. The process continues with a second wafer that includes a second metal connection layer and a second passivation layer. The invention allows for the stacking of the second wafer on the first wafer by bonding their respective bondpad layers using conductive adhesive layers. This innovative method improves the performance and integration of semiconductor devices.

Career Highlights

Hai-Jun Zhao is currently employed at Promos Technologies, Inc. His work at this company focuses on advancing semiconductor technologies. He has demonstrated a strong commitment to innovation and research in his field.

Collaborations

Hai-Jun Zhao collaborates with Min-Liang Chen, a fellow professional in the semiconductor industry. Their partnership contributes to the development of cutting-edge technologies.

Conclusion

Hai-Jun Zhao's contributions to semiconductor technology through his patent and work at Promos Technologies, Inc. highlight his role as an influential inventor in the industry. His innovative methods continue to shape the future of semiconductor devices.