This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Samsung Electronics Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Haejung Yu and Semiconductor Packaging Innovation.
Introduction
Haejung Yu is an inventor based in Hwaseong, South Korea, associated with Samsung Electronics Co., Ltd. His listed patent focuses on semiconductor packaging, combining stacked chips and an interposer in a single package design.
Latest Patents
Yu is credited with 1 patent: “Semiconductor Package Including Interposer.” The invention describes an interposer with a base layer and through-electrodes, a stacked structure containing a first semiconductor chip and sequentially stacked second chips, and additional semiconductor chips attached beside the stack. Molding layers surround the chip structures and extend across the interposer. The design brings multiple chip arrangements together within one semiconductor package.
Career Highlights
The available information identifies Yu’s work through this patent and his association with Samsung Electronics Co., Ltd. The patent reflects an engineering focus on semiconductor packaging and the integration of stacked chips.
Collaborations
Yu’s listed coworker is Soohyun Nam. The provided information does not specify her role in the patent or describe the nature of their collaboration.
Conclusion
Haejung Yu’s recorded patent presents an interposer-based approach to integrating stacked and adjacent semiconductor chips, highlighting his contribution to semiconductor packaging innovation.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile