The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2026
Filed:
Nov. 10, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Soohyun Nam, Hwaseong-si, KR;
Haejung Yu, Hwaseong-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A semiconductor package includes an interposer including a base layer and a plurality of interposer through-electrodes penetrating the base layer; at least one stacked structure attached to the interposer and including a first semiconductor chip, a plurality of second semiconductor chips sequentially stacked on the first semiconductor chip, and a chip molding layer on a side surface of the plurality of second semiconductor chips; a plurality of third semiconductor chips attached to the interposer adjacent the at least one stacked structure; and a package molding layer extending around the at least one stacked structure and the plurality of third semiconductor chips on the interposer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile