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For the Inventor, By the Inventor

Seoul, South Korea

Haejin Lee

This inventor holds 16 USPTO granted patents and 5 published patent applications and 5 EPO patents, primarily in Electronic Device Cooling. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2020-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Haejin Lee. Retrieved from https://idiyas.com/inventor/haejin-lee

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 16 

% Patents Active = 100.0

 

Average Co-Inventor Count = 5.5

ph-index = 4

Forward Citations = 28(Granted Patents)


Location History:

  • Seoul, KR (2020 - 2023)
  • Gyeonggi-do, KR (2020 - 2024)
  • Suwon-si, KR (2022 - 2024)

Company Filing History:

goldMedal16 out of 138,670 
 
Samsung Electronics Co., Ltd.
 patents

Years Active: 2020-2025

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Areas of Expertise:
Foldable Display
Printed Circuit Board
Thermal Interface Material
mmWave Antenna
Heat Dissipation
Noise Inducing Structure
Phase Change Material
Heat Collection
Electromagnetic Shielding
Cooling Fan Control
Nonmetallic Heat Dissipation
Heat Transfer Member
16 patents (USPTO):Explore Patents
1. 12335424 - Electronic device including foldable display (2025-06-17),
2. 12317407 - Electronic device including printed circuit board structure including thermal interface material (2025-05-27),
3. 12278420 - Electronic device including mmWave antenna module (2025-04-14),
4. 12238911 - Electronic device including sheilding structure (2025-02-25),
5. 11978950 - Electronic device including noise inducing structure (2024-05-07),
6. 11895767 - Electronic device filled with phase change material between plurality of circuit boards connected by connecting members (2024-02-06),
7. 11874471 - Electronic device including heat radiating member (2024-01-16),
8. 11632881 - Method for controlling cooling fan and wireless charging device (2023-04-18),
9. 11555657 - Electronic device having heat collection/diffusion structure (2023-01-17),
10. 11503748 - Electromagnetic-wave-shielding sheet capable of dissipating heat of electronic component and electronic device including the same (2022-11-15),
11. 11497141 - Heat dissipation device formed of nonmetallic material and electronic device including the same (2022-11-08),
12. 11304337 - Electronic device comprising heat transfer member having metal plate and heat transfer material coupled thereto (2022-04-12),
13. 11098959 - Electronic device having heat collection/diffusion structure (2021-08-24),
14. 11047628 - Electronic device having heat collection/diffusion structure (2021-06-29),
15. 10798849 - Electronic device having heat collection/diffusion structure (2020-10-06),

Title: Inventor Haejin Lee: Revolutionizing Technology in Seoul

Introduction: Haejin Lee is a pioneering inventor based in Seoul, South Korea, known for her groundbreaking contributions to the field of technology.

Latest Patents: Lee's most recent patents focus on advancements in artificial intelligence and sustainable energy solutions, showcasing her commitment to innovation and sustainability.

Career Highlights: With a career spanning over two decades, Haejin Lee has established herself as a leading figure in the tech industry, with a strong focus on developing cutting-edge technologies that have the potential to shape the future.

Collaborations: Throughout her career, Lee has collaborated with top research institutions, universities, and tech companies to bring her inventions to life, fostering a culture of innovation and collaboration in the industry.

Conclusion: Haejin Lee's passion for innovation and her dedication to pushing the boundaries of technology make her a true trailblazer in the field of inventions, with a lasting impact on the industry and society as a whole.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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