Samsung Electronics Co., Ltd.

Haejin Lee

Kyungha Koo

Jungje Bang

Jaeheung Ye

Kyuhwan Lee

Se-Young Jang

Chunghyo Jung

Yunjeong Park

Seyoung Jang

Jihong Kim

Kuntak Kim

Min Cheol Park

Min Sang Park

Chihwan Jeong

Seungnyun Kim

Younghoon Kim

Chi-Hyun Cho

Dongku Kang

Hongki Moon

Jinhwan Jung

Hyunmo Yang

Seungjoo Lee

Min Sun Park

Min Jae Park

Sangchul Jung

Younsang Yoo

Hyuntae Jang

Jungkeun Lee

Hajoong Yun

Taewook Ham

Youngho Yoon

Kyeongsoo Kim

Juhee Han

Yeonkyung Chung

Younggirl Yun

Dongkee Jung

Ahreum Hwang

Juhyun Park

Jooho Jang

According to various embodiments of the present disclosure, an electronic device may include a first housing, a second housing connected to the first housing via a hinge structure, an electronic component, a flexible display being configured to be foldable according to rotation, a heat dissipation sheet arranged under the flexible display, and a first adhesive layer configured to bond the flexible display and the heat dissipation sheet to each other. The heat dissipation sheet may include a first portion corresponding to the first housing, a second portion corresponding to the second housing, and a third portion interconnecting the first portion and the second portion and corresponding to the hinge structure. The third portion may include a structure that protrudes or is folded at least once with respect to the first portion and the second portion. The first adhesive layer may include a first opening corresponding to the third portion.

Electronic device including foldable display

An electronic device includes a printed circuit board ('PCB') structure which accommodates a thermal interface material (“TIM”). The PCB structure includes a base plate, a first component on the base plate, a second component on the base plate and apart from the first component, an interposer connected to the base plate and surrounding the first component and the second component, a cover plate connected to the interposer and covering the first component and the second component, and an accommodation part which is between the base plate and a heat conduction plate and accommodates the TIM.

Electronic device including printed circuit board structure including thermal interface material

According to certain embodiments, an electronic device comprises: a window forming at least a portion of a front surface of the electronic device; a cover forming at least a portion of a rear surface of the electronic device; a bracket disposed between the window and the cover; a printed circuit board supported by the bracket and disposed between the window and the cover; a shield can disposed on the printed circuit board covering a designated area of the printed circuit board; at least one communication processor disposed on the printed circuit board; and a mmWave antenna module connected to the printed circuit board, and electrically connected with the at least one communication processor via the printed circuit board, wherein the mmWave antenna module is disposed on the shield can and configured to transfer heat to the shield can.

Electronic device including mmWave antenna module

The disclosure relates to an electronic device including: a circuit board; a first component disposed on the circuit board; a shield can disposed to surround at least a part of the first component and including an opening; and a nanofiber film disposed on the shield can to cover the opening, wherein the nanofiber film includes a first layer, a second layer, and a third layer sequentially laminated in a first direction, the first layer or the third layer having a lower electrical resistance value than an electrical resistance value of the second layer in a second direction different from the first direction, and the second layer has a lower electrical resistance value than an electrical resistance value of the first layer or the third layer in the first direction.

Electronic device including sheilding structure

According to various embodiments, an electronic device includes: a housing including a conductive part; an antenna module, including a substrate including a first substrate surface, a second substrate surface facing a direction opposite a direction of the first substrate surface, and a substrate side surrounding a space between the first substrate surface and the second substrate surface, at least one antenna element disposed in the substrate, wireless communication circuitry disposed in the substrate and configured to transmit and/or receive a radio signal in the direction toward which the first substrate surface is directed through the at least one antenna element, a protection member disposed on the second substrate surface, and a conductive shield layer disposed on at least an external surface of the protection member, as an antenna module disposed in an internal space of the housing; a conductive member disposed in at least a part of the conductive part and having at least a partial area thereof facing at least a part of the conductive shield layer; and a noise induction layer disposed between the antenna module and the conductive member to form a capacitor structure having a specified capacitance value between the conductive shield layer and the conductive member. Noise induced from the antenna module may be induced toward the conductive part through the capacitor structure.

Electronic device including noise inducing structure

Various embodiments of the present invention relate to an electronic device including a stacked circuit board. The electronic device comprises: a first circuit board; a second circuit board; one or more circuit elements disposed on the second circuit board; and a connecting member disposed between the first circuit board and the second circuit board facing the first circuit board to form an internal space surrounding at least some of the one or more circuit elements, and to electrically connect the first and second circuit boards, wherein the internal space may be filled with a phase change material (PCM) that absorbs heat generated by the at least some circuit elements to change the state of the material. Various other embodiments of the present invention may be additionally provided.

Electronic device filled with phase change material between plurality of circuit boards connected by connecting members

A wearable electronic device is disclosed, including: a housing including a first surface facing a same direction as a gaze of a user, a second surface facing in a second direction towards a face of the user, and a side surface surrounding a space defined between the two surfaces, a first and second light output device disposed in the housing and configured to output an image, a printed circuit board at least partially disposed between the first and second light output device, and including at least one electronic component, a supportive frame, a battery disposed between the frame and the second surface, and a first heat radiating member disposed between the frame and the battery.

Electronic device including heat radiating member

The disclosure relates to a wireless charging device including a cooling fan, and the wireless charging device according to an embodiment of the disclosure includes: a housing including a holding portion configured to hold an external electronic device; a first bracket positioned in the holding portion; a conductive coil disposed in the first bracket; a second bracket positioned in the holding portion and including a penetrating hole; a first cooling fan positioned in the penetrating hole; a second cooling fan positioned in the penetrating hole and spaced apart from the first cooling fan; and a partition formed in the penetrating hole to isolate the first cooling fan and the second cooling fan from each other, the penetrating hole being divided into a first area having the first cooling fan disposed therein and a second area having the second cooling fan positioned therein, at least one protrusion having a volute shape formed on at least a portion of the second bracket or at least a portion of the partition, a first opening formed on at least an area of the first bracket to allow air cooled by the first cooling fan and/or the second cooling fan to move to the holding portion, and a second opening formed on at least an area of the holding portion to allow the air transmitted from the first opening to move outside the wireless charging device.

Method for controlling cooling fan and wireless charging device

An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.

Electronic device having heat collection/diffusion structure

A portable communication device is provided. A portable communication device includes a first nanofiber member having a first density, a second nanofiber member attached to the first nanofiber member and having a second density lower than the first density, a heat transfer member positioned on or above the second nanofiber member, and a conductive material coated on at least a portion of the first nanofiber member and the second nanofiber member. At least some of the conductive material may penetrate into the first nanofiber member or the second nanofiber member. Various other embodiments may be possible.

Electromagnetic-wave-shielding sheet capable of dissipating heat of electronic component and electronic device including the same

A heat dissipation device is provided. The heat dissipation device includes a container including a first plate, and a second plate spaced apart from the first plate to define an interior space, at least one filler disposed between the first plate and the second plate and configured to support the first plate and the second plate, a wick layer located on an inner wall defined in the interior space by the first plate or the second plate, and a working fluid configured to flow in the interior space in a gaseous state, and flow in the wick layer in a liquefied state, wherein the container further includes a fluoride-based polymer having a predetermined gas permeability.

Heat dissipation device formed of nonmetallic material and electronic device including the same

Various embodiments of the present invention relate to an electronic device comprising a shielding structure which is arranged on the periphery of an electronic component, and which has an improved heat-radiating performance. The electronic device comprises: a circuit board; a non-elastic shielding member arranged on one surface of the circuit board, the non-elastic shielding member having a concave portion and an opening formed on a part of the concave portion; a processor contained in the concave portion and arranged on the one surface so as to correspond to the opening; a first heat transfer member arranged to contact the outer surface of the processor in at least a partial area of the opening; an elastic shielding member arranged on the periphery of the opening; and a second heat transfer member arranged to contact the first heat transfer member and the elastic shielding member. The second heat transfer member comprises a metal plate and a heat transfer material having a thermal conductivity higher than 1 W/mK. The heat transfer material may be coupled to the metal plate. The present invention may further comprise various other embodiments.

Electronic device comprising heat transfer member having metal plate and heat transfer material coupled thereto

Growing community of inventors

Seoul, South Korea

Haejin Lee