Anyang-si, South Korea

Hae-jung Yu


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 9(Granted Patents)


Company Filing History:


Years Active: 2011-2013

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2 patents (USPTO):Explore Patents

Title: Innovator Spotlight: Hae-jung Yu - A Pioneer in Electronic Device Fabrication

Introduction: Hae-jung Yu, an accomplished inventor based in Anyang-si, South Korea, has made significant contributions to the field of electronics. With a notable count of two patents to her name, Yu's work focuses on advancing technology in electronic device packaging and fabrication methods.

Latest Patents: Hae-jung Yu's latest inventions include two innovative patents. The first is a "Molded Underfill Flip Chip Package Preventing Warpage and Void," which features a design that includes a printed circuit board, a semiconductor chip, and a sealant. This design not only enhances durability but also addresses common issues like warpage and voids in semiconductor applications. The second patent, "Method of Fabricating Electronic Device Having Stacked Chips," presents a novel technique for arranging and connecting chips in a stacked configuration, facilitating efficient manufacturing processes.

Career Highlights: Currently employed at Samsung Electronics Co., Ltd., Hae-jung Yu has been instrumental in advancing the company's capabilities in electronic packaging technologies. Her innovative approach has paved the way for more reliable electronic devices, and her contributions underscore her role as a leader in her field.

Collaborations: Throughout her career, Hae-jung Yu has had the opportunity to collaborate with talented professionals including Hyeong-seob Kim and Jong-Ho Lee. These collaborations have enriched her work and fostered a collective effort towards innovation in electronic device fabrication.

Conclusion: Hae-jung Yu's contributions to the field of electronics, highlighted through her patents and collaborations, showcase her commitment to innovation. As technology continues to advance, her work serves as a foundation for future developments in electronic packaging and device fabrication. Yu's journey is an inspiring example for aspiring inventors and industry professionals alike.

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