Growing community of inventors

Anyang-si, South Korea

Hae-jung Yu

Average Co-Inventor Count = 4.00

ph-index = 1

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 9

Hae-jung YuJin-Woo Park (1 patent)Hae-jung YuJong-Ho Lee (1 patent)Hae-jung YuNam-seog Kim (1 patent)Hae-jung YuEun-Chul Ahn (1 patent)Hae-jung YuTae-Gyeong Chung (1 patent)Hae-jung YuHyeong-seob Kim (1 patent)Hae-jung YuHae-jung Yu (2 patents)Jin-Woo ParkJin-Woo Park (218 patents)Jong-Ho LeeJong-Ho Lee (124 patents)Nam-seog KimNam-seog Kim (42 patents)Eun-Chul AhnEun-Chul Ahn (20 patents)Tae-Gyeong ChungTae-Gyeong Chung (17 patents)Hyeong-seob KimHyeong-seob Kim (5 patents)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Samsung Electronics Co., Ltd. (2 from 131,214 patents)


2 patents:

1. 8592997 - Molded underfill flip chip package preventing warpage and void

2. 7923291 - Method of fabricating electronic device having stacked chips

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as of
12/6/2025
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