Company Filing History:
Years Active: 2011
Title: Innovator Hachiya Takeuchi - A Pioneer in Bonding Technology
Introduction
Hachiya Takeuchi is a notable inventor based in Yokohama, Japan. He is recognized for his contributions to bonding technology, particularly through his work with Shibaura Mechatronics Corporation. As an inventor, he holds one patent that reflects his innovative approach to problem-solving in the field of substrate bonding.
Latest Patents
Takeuchi's patent titled "Bonding apparatus and bonding method" addresses a critical issue in substrate bonding: preventing warping. The patent provides a solution by ensuring a sufficient standing time for substrates after bonding, utilizing a simple and compact apparatus. The design includes substrate carrying parts arranged around the circumference of a rotating turntable, guiding substrates through various positions including bonding, pre-curing, curing, and post-curing stages, ultimately correcting any warping that may occur.
Career Highlights
Takeuchi's career at Shibaura Mechatronics Corporation has been marked by a focus on innovation and efficiency in bonding processes. His work emphasizes the importance of maintaining optimal conditions for substrates, resulting in enhanced product quality. His single patent demonstrates a clear understanding of the technical challenges in the industry and showcases his creativity in developing effective solutions.
Collaborations
Throughout his career, Takeuchi has collaborated with talented colleagues such as Shohei Tanabe and Hisashi Nishigaki. Working alongside these professionals, he has contributed to advancing bonding technologies and driving innovation within Shibaura Mechatronics Corporation.
Conclusion
Hachiya Takeuchi's work stands as a testament to the power of innovation in addressing industry challenges. His patent illustrates a thoughtful approach to enhancing substrate bonding processes, providing valuable insights for future developments. As a respected inventor in Yokohama, Takeuchi continues to inspire others in the field of bonding technology.