The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2011
Filed:
Dec. 03, 2004
Hachiya Takeuchi, Yokohama, JP;
Shohei Tanabe, Yokohama, JP;
Hisashi Nishigaki, Yokohama, JP;
Shibaura Mechatronics Corporation, Kanagawa, JP;
Abstract
The present invention provides a bonding apparatus and bonding method which can prevent warping of substrates by ensuring a sufficient standing time following bonding of the substrates, using a simple and compact apparatus. Substrate carrying partsare formed along the circumference of a rotating turntable. The respective substrate carrying partsare formed so that these parts pass through substrate placement positionsand, a bonding position, pre-curing standing positionsthrough, a curing position, a post-curing standing positionand a conveying positionas the turntablerotates. After being bonded in the bonding position, the substrates move through the pre-curing standing positionsthroughas a result of the rotation of the turntable, and are allowed to stand for a fixed period of time, so that warping is corrected.