Habeeb Mohiuddin Mohammed

Title: Innovations of Habeeb Mohiuddin Mohammed

Introduction

Habeeb Mohiuddin Mohammed is a notable inventor based in Wilheim an der Teck, Germany. He has made significant contributions to the field of semiconductor technology, holding a total of 6 patents. His work focuses on advanced packaging solutions that enhance the performance of high power semiconductor devices.

Latest Patents

One of his latest patents is a multi-pin wafer-level chip scale packaging solution for high power semiconductor devices. This innovative design achieves a multi-pin wafer level chip scale package by forming one or more solder pillars and solder blocks on a silicon wafer. The top surfaces of these components are aligned in the same horizontal plane. A pillar metal layer underlies the solder pillars, establishing electrical contact with the silicon wafer through an opening in a polymer layer over a passivation layer. Additionally, a block metal layer underlies the solder blocks, connecting them to the silicon wafer through multiple via openings in the polymer layer, with the block metal layer being thicker than the pillar metal layer.

Career Highlights

Habeeb is currently employed at Dialog Semiconductor (UK) Limited, where he continues to innovate in the semiconductor industry. His expertise in chip packaging solutions has positioned him as a key player in the development of advanced semiconductor technologies.

Collaborations

Throughout his career, Habeeb has collaborated with several talented individuals, including Rajesh Subraya Aiyandra and Ian Kent. These collaborations have further enriched his work and contributed to the success of his projects.

Conclusion

Habeeb Mohiuddin Mohammed's contributions to semiconductor technology through his innovative patents and collaborations highlight his importance in the field. His work continues to pave the way for advancements in high power semiconductor devices.