Company Filing History:
Years Active: 1990-1999
Title: H Ward Conru: Innovator in Semiconductor Technology
Introduction
H Ward Conru is a notable inventor based in Essex Junction, VT (US). He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work has been instrumental in advancing the efficiency and reliability of semiconductor packages.
Latest Patents
Conru's latest patents include innovative designs that enhance the functionality of semiconductor lead frames. One of his patents describes a lead frame with multiple metallic conductors, each featuring a coined or stamped region near its proximal end. This design provides pressure points that ensure substantial and even joining of the conductor to the semiconductor chip using an insulative adhesive medium. The encapsulation of the lead frame and wires with suitable insulative material forms a robust semiconductor module or package.
Another significant patent focuses on a planarized thin film surface covered wire bonded semiconductor package. This invention improves the conductive path between the chip and the lead frame by enhancing the bond between the wires and the lead frame members. By placing an insulating layer on the active surface of each chip, the design allows for greater contact between the wires and leads, thereby reducing the likelihood of defects or failures in conductivity.
Career Highlights
H Ward Conru is currently associated with the International Business Machines Corporation (IBM), where he continues to innovate in semiconductor technology. His work has not only contributed to the company's advancements but has also set new standards in the industry.
Collaborations
Throughout his career, Conru has collaborated with notable colleagues, including Stephen G Starr and William C Ward. These collaborations have fostered a creative environment that has led to groundbreaking innovations in semiconductor technology.
Conclusion
H Ward Conru's contributions to semiconductor technology through his patents and collaborations have significantly impacted the industry. His innovative designs continue to enhance the performance and reliability of semiconductor packages, solidifying his reputation as a leading inventor in this field.