H Frank Greer

Title: H Frank Greer: Innovator in Flip-Chip Technology

Introduction

H Frank Greer, based in Pasadena, California, is a notable inventor recognized for his contributions to advancements in flip-chip technology. With a keen focus on improving indium bump bonding, Greer has made significant strides in reducing contact resistance in electronic components.

Latest Patents

Greer holds a single patent titled "Method to improve indium bump bonding via indium oxide removal using a multi-step plasma process." This novel process outlines a method for effectively removing indium oxide from indium bumps, enhancing the performance of flip-chip structures. The innovation involves a two-step plasma treatment: the first employs an argon, methane, and hydrogen plasma to reduce indium oxide, while the second utilizes an argon and hydrogen plasma to eliminate residual organics. Notably, this method avoids the use of halogens, preserves bump morphology, and does not compromise the bond pad material or under-bump metallization layers. Additionally, it creates no new mechanisms for open circuits, showcasing Greer's commitment to efficient and safe technological progress.

Career Highlights

H Frank Greer has contributed to groundbreaking research through his association with the National Aeronautics and Space Administration (NASA). Serving as a representative of the United States of America, Greer has been involved in projects that push the boundaries of technology and engineering within the aerospace sector.

Collaborations

Throughout his career, Greer has collaborated with distinguished colleagues, including Todd J. Jones and Richard P. Vasquez. Together, they have shared insights and expertise that have further advanced their innovative projects, particularly in the realm of semiconductor technology and electronic device manufacturing.

Conclusion

H Frank Greer's innovative approach to indium bump bonding reflects a significant advancement in the field of electronics. His patented methods not only enhance efficiency but also underline the importance of safety and reliability in technology. As he continues his work with NASA, Greer is poised to remain at the forefront of innovation in electronic manufacturing processes.