This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Samsung Electronics Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Gyu Jin Choi and Semiconductor Packaging Innovation.
Introduction
Gyu Jin Choi is an inventor associated with Asan-si, South Korea, and Samsung Electronics Co., Ltd. His patent work includes a semiconductor package design that connects components through a layered metal structure.
Latest Patents
Choi is credited with 1 patent, titled “Semiconductor package.” The invention describes a substrate with a first semiconductor chip on its upper surface and an interposer above the chip. A connecting portion, positioned apart from the chip, electrically connects a conductive pad on the substrate to the interposer. It comprises a first metal layer on the pad, a second layer made of a different metal, and a metal post made of a third, distinct metal.
Career Highlights
Choi’s listed patent reflects work in semiconductor packaging, where reliable electrical connections between package components are important. His professional affiliation is Samsung Electronics Co., Ltd.
Collaborations
The provided information identifies Jae-Ean Lee as Choi’s coworker. The patent details supplied here do not specify the coworker’s role in the invention.
Conclusion
Gyu Jin Choi’s recorded invention focuses on a multilayer metal connection for a semiconductor package, highlighting his contribution to semiconductor packaging technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile