The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2026
Filed:
Jun. 09, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Jae-Ean Lee, Suwon-si, KR;
Gyu Jin Choi, Asan-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package is provided. The semiconductor package includes: a substrate; a first semiconductor chip provided on an upper surface of the substrate; an interposer provided on the first semiconductor chip; a conductive pad provided on the upper surface of the substrate; and a connecting portion provided between the upper surface of the substrate and a lower surface of the interposer, wherein the connecting portion is spaced apart from the first semiconductor chip along a horizontal direction parallel to the upper surface of the substrate, and electrically connects the conductive pad and the interposer, and the connecting portion includes a first metal layer provided on the conductive pad, a second metal layer provided on the first metal layer, and a metal post provided on the second metal layer, wherein the first metal layer includes a first metal, the second metal layer includes a second metal different from the first metal, and the metal post includes a third metal different from the first metal and the second metal.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile