This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Henkel IP Holding Gmbh. Active years: 2016.
Company Filing History:
Years Active: 2016
Title: Gyanendra Dutt: Innovator in Semiconductor Technology
Introduction
Gyanendra Dutt is a notable inventor based in Garden Grove, CA (US). He has made significant contributions to the field of semiconductor technology, particularly with his innovative approach to adhesive coatings.
Latest Patents
Gyanendra Dutt holds a patent for a unique invention titled "Wafer back side coating as dicing tape adhesive." This invention involves a semiconductor assembly that comprises a semiconductor wafer, an adhesive coating on the back side of the wafer, and a bare dicing tape that is preferably UV radiation transparent. The method for preparing this assembly includes several steps: providing a semiconductor wafer, applying a wafer back side coating, partially curing the coating to ensure it adheres to the wafer while remaining tacky, and finally, contacting the bare dicing tape to the partially cured coating, optionally with heat and pressure. This innovative approach enhances the efficiency and effectiveness of semiconductor assembly processes.
Career Highlights
Gyanendra Dutt is currently associated with Henkel IP Holding GmbH, where he continues to develop and refine his inventions. His work in the semiconductor industry has positioned him as a key player in advancing technology in this field.
Collaborations
Gyanendra has collaborated with talented coworkers such as Qizhuo Zhuo and Stephen Ruatta, contributing to a dynamic and innovative work environment.
Conclusion
Gyanendra Dutt's contributions to semiconductor technology through his patent and work at Henkel IP Holding GmbH highlight his role as an influential inventor. His innovative methods are paving the way for advancements in the industry.