Henkel IP Holding Gmbh

Gyanendra Dutt

Qizhuo Zhuo

Stephen Ruatta

Elizabeth Hoang

A semiconductor assembly comprises a semiconductor wafer, an adhesive coating disposed on the back side of the wafer, and a bare dicing tape, preferably UV radiation transparent. The assembly is prepared by the method comprising (a) providing a semiconductor wafer, (b) disposing a wafer back side coating on the semiconductor wafer, (c) partially curing the wafer back side coating to the extent that it adheres to the back side of the wafer and remains tacky, and (d) contacting the bare dicing tape to the partially cured and tacky wafer back side coating, optionally with heat and pressure.

Growing community of inventors

Garden Grove, CA, United States of America

Gyanendra Dutt