This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Bank of America Corporation. Active years: 2018.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2018
Title: Gurdeep Singh Walia: Financial Systems Inventor
Introduction
Gurdeep Singh Walia is an inventor based in Hyderabad, Telangana, India, associated with Bank of America Corporation. His work includes a patented tool designed to support temporary waivers in financial systems.
Latest Patents
Walia is credited with 1 patent, titled “Temporary Waiver Tool.” The invention describes systems, methods, and computer program products that automate data communication for requesting and processing temporary waivers. A system can receive a request to assign a temporary waiver to an account linked to paid services, send the request to a processing entity for review, and receive an approval decision. Based on that decision, it can then take a subsequent action to provide or decline the waiver.
Career Highlights
Walia’s patent focuses on automating the handling of temporary waiver requests in financial services. The described process connects the requesting entity with a processing entity and supports follow-up actions based on the approval decision.
Collaborations
Walia’s listed coworkers include Saroj Kumar Bonthapalli and Anand Daga. His association with Bank of America Corporation provides the organizational context for his work in financial systems.
Conclusion
Gurdeep Singh Walia’s patented temporary waiver tool addresses the automated review and handling of waiver requests, reflecting an application of software-based processes to financial services.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile