Tianjin, China

Guoliang Gong

USPTO Granted Patents = 2 

Average Co-Inventor Count = 4.8

ph-index = 2

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2013-2014

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2 patents (USPTO):Explore Patents

Title: Guoliang Gong: Innovator in Semiconductor Technology

Introduction

Guoliang Gong is a prominent inventor based in Tianjin, China. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative approach to semiconductor packaging and wire bonding processes.

Latest Patents

One of his latest patents is for a "Stacked Die Semiconductor Package." This invention involves a semiconductor package and a method of assembling it, which includes encapsulating a first pre-packaged semiconductor die stacked on top of and interconnected with a second semiconductor die. The first packaged semiconductor die is positioned and fixed relative to a lead frame using a temporary carrier such as tape. The second semiconductor die is directly attached and interconnected to the first packaged semiconductor die and lead frame. This encapsulation process allows for the formation of various types of semiconductor packages, such as quad flat no-lead (QFN) and ball grid array (BGA), which enhance input/output (I/O) count and functionality.

Another notable patent is the "Method and Apparatus for Monitoring Free Air Ball (FAB) Formation in Wire Bonding." This method involves attaching a dummy bond wire to an unused location on a semiconductor chip carrier. The dummy bond wire is extended a predetermined distance from the surface, allowing for the formation of a dummy FAB at its tip. An imaging unit inspects the profile of the dummy FAB to identify defects. If a defect is detected, an alarm is triggered, halting the wire bonding process to adjust bonding parameters before restarting.

Career Highlights

Guoliang Gong is currently employed at Freescale Semiconductor, Inc., where he continues to develop innovative solutions in semiconductor technology. His work has significantly impacted the efficiency and reliability of semiconductor packaging and bonding processes.

Collaborations

Throughout his career, Guoliang has collaborated with talented individuals such as Shunan Qiu and Xuesong Xu. These collaborations have fostered a creative environment that encourages innovation and the advancement of semiconductor technologies.

Conclusion

Guoliang Gong's contributions to semiconductor technology through his patents and work at Freescale Semiconductor, Inc. highlight his role as a key innovator in the field. His inventions not only improve existing technologies but also pave the way for future advancements in semiconductor applications.

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