Freescale Semiconductor,inc.

Guoliang Gong

Xingshou Pang

Xuesong Xu

Meiquan Huang

Hejin Liu

Fei Zong

Shunan Qiu

Beiyue Yan

Yinghui Li

A semiconductor package and method of assembling a semiconductor package includes encapsulating a first pre-packaged semiconductor die stacked on top of and interconnected with a second semiconductor die. The first packaged semiconductor die is positioned and fixed relative to a lead frame with a temporary carrier such as tape. The second semiconductor die is attached and interconnected directly to the first packaged semiconductor die and lead frame. The interconnected first packaged die and second semiconductor die, and lead frame are encapsulated to form the semiconductor package. Different types of semiconductor packages such as quad flat no-lead (QFN) and ball grid array (BGA) may be formed, which provide increased input/output (I/O) count and functionality.

Stacked die semiconductor package

A method for monitoring free air ball (FAB) formation during a wire bonding process includes attaching a dummy bond wire to an unused location on a first surface of a semiconductor chip carrier, extending the dummy bond wire a predetermined distance from the first surface such that a tip of the dummy bond wire is spaced from the first surface, and forming a dummy FAB at the tip of the bond wire. A profile of the dummy FAB is inspected with an imaging unit to identify any defects in the dummy FAB. An alarm is triggered and the wire bonding process is halted if the dummy FAB is defective so that bonding parameters may be adjusted. The wire bonding process is restarted after the bonding parameters have been adjusted.

Method and apparatus for monitoring free air ball (FAB) formation in wire bonding

Growing community of inventors

Tianjin, China

Guoliang Gong