This inventor holds 1 USPTO granted patent. Top assignee: Nantong Fujitsu Microelectronics Co., Ltd.. Active years: 2016.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2016
Title: **Guoji Yang: Innovator in Semiconductor Packaging**
Introduction
Guoji Yang, an accomplished inventor based in Nantong, China, has made significant contributions to the field of semiconductor packaging. With 1 patent to his name, Yang is recognized for his innovative approach to integrating chips and passive devices, showcasing the potential for enhanced functionality in manufactured products.
Latest Patents
Guoji Yang's notable patent focuses on a unique packaging structure that includes a carrier board, a cementing layer on its surface, chips, and passive devices. The invention allows for the attachment of these components to the cementing layer, with a sealing material layer providing effective packaging and curing. This integration results in a packaged product that boasts not just single-chip functionality but integrated-system functionality. His invention is designed to be highly integrated, minimizing electrical resistance and inductance within the system, while accommodating the increasing demand for lighter, thinner, shorter, and smaller semiconductor packaging.
Career Highlights
Yang is currently employed at Nantong Fujitsu Microelectronics Co., Ltd., a prominent player in the semiconductor industry. His work emphasizes the importance of innovation in driving advancements in technology and manufacturing processes.
Collaborations
Throughout his career, Guoji Yang has collaborated with talented coworkers such as Lei Shi and Yujuan Tao. These collaborations highlight the synergistic efforts involved in pushing the boundaries of semiconductor technology and the development of cutting-edge packaging solutions.
Conclusion
Guoji Yang represents the innovative spirit that drives the semiconductor industry forward. Through his contributions, he continues to redefine the possibilities within semiconductor packaging, paving the way for future advancements in technology. His work at Nantong Fujitsu Microelectronics Co., Ltd. underscores the importance of collaboration and innovation in achieving significant breakthroughs.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile