Gunarto Wibowo

Title: Gunarto Wibowo: Innovator in Electronic Packaging Technology

Introduction

Gunarto Wibowo is a notable inventor based in Batam, Indonesia. He has made significant contributions to the field of electronic packaging technology. His innovative approach has led to the development of a unique patent that enhances the functionality of electronic packages.

Latest Patents

Gunarto holds a patent for "Lead frames with wettable flanks," which describes a method of producing wettable fillets in electronic packages. This patent involves a matrix of unsingulated lead frames, each containing multiple lead elements and a chip pad. Chips are attached to the chip pads, and the terminals on the chips are electrically connected to the lead portions of the lead elements. The top portion of the package is encapsulated, while masking is applied to the bottom surface of the lead elements and chip pads. Notably, at least one of the lead elements has a portion of its surface remaining exposed. The exposed lead element surface is then etched to create a fillet. Finally, the fillets, lead elements, and bottom surface of the chip pads are plated, and the packages are singulated, resulting in packages with wettable flanks.

Career Highlights

Gunarto Wibowo is currently employed at Unisem (M) Berhad, where he continues to innovate in the field of electronic packaging. His work has been instrumental in advancing the technology used in electronic components, making them more efficient and reliable.

Collaborations

Gunarto collaborates with talented coworkers, including Mustanir and Maria Cristina T Santillan. Their combined expertise contributes to the success of their projects and the advancement of technology at Unisem.

Conclusion

Gunarto Wibowo's contributions to electronic packaging technology through his innovative patent demonstrate his commitment to advancing the field. His work at Unisem (M) Berhad and collaborations with skilled colleagues further enhance the impact of his inventions.