The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2018
Filed:
Mar. 16, 2015
Unisem (M) Berhad, Kuala Lumpur, MY;
Mustanir, Batam, ID;
Maria Cristina T. Santillan, Novaliches, PH;
Debie Agung Setiawan, Batam, ID;
Yulia Natilova, Batam, ID;
Gunarto Wibowo, Batam, ID;
UNISEM (M) BERHAD, Kuala Lumpur, MY;
Abstract
A method of producing wettable fillets in electronic packages. A matrix of unsingulated lead frames is provided, each including a plurality of lead elements and a chip pad. Chips are attached to the chip pads and terminals on the chips are electrically connected to lead portions of the lead elements. The top portion of the package is encapsulated. Masking is applied to the bottom surface of the lead elements and the chip pads, but at least one of the lead elements has a portion of its surfaced remaining exposed. The exposed lead element surface is etched to create a fillet. The fillets, lead elements and bottom surface of the chip pads are plated, and the packages then singulated, producing packages with wettable flanks.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile