Debie Agung Setiawan

Title: Debie Agung Setiawan: Innovator in Electronic Packaging Technology

Introduction

Debie Agung Setiawan is a notable inventor based in Batam, Indonesia. He has made significant contributions to the field of electronic packaging technology. His innovative approach has led to the development of a unique patent that enhances the functionality of electronic packages.

Latest Patents

Debie holds a patent for "Lead frames with wettable flanks," which describes a method of producing wettable fillets in electronic packages. This patent involves a matrix of unsingulated lead frames, each containing multiple lead elements and a chip pad. Chips are attached to the chip pads, and the terminals on the chips are electrically connected to the lead portions of the lead elements. The top portion of the package is encapsulated, while masking is applied to the bottom surface of the lead elements and chip pads. Notably, at least one of the lead elements has a portion of its surface remaining exposed. This exposed surface is etched to create a fillet, and the fillets, lead elements, and bottom surface of the chip pads are plated. The packages are then singulated, resulting in packages with wettable flanks.

Career Highlights

Debie Agung Setiawan is currently employed at Unisem (M) Berhad, where he continues to innovate in the field of electronic packaging. His work has been instrumental in advancing the technology used in electronic components, making them more efficient and reliable.

Collaborations

Debie collaborates with talented individuals such as Mustanir and Maria Cristina T Santillan, who contribute to the innovative environment at Unisem (M) Berhad. Their teamwork fosters creativity and drives the development of cutting-edge technologies.

Conclusion

Debie Agung Setiawan's contributions to electronic packaging technology through his patent and work at Unisem (M) Berhad highlight his role as an influential inventor. His innovative methods are paving the way for advancements in the industry.