Dresden, Germany

Guido Thielscher


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 8(Granted Patents)


Company Filing History:


Years Active: 2008

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1 patent (USPTO):

Title: Innovator Guido Thielscher: A Leader in Semiconductor Technology

Introduction

Guido Thielscher, an accomplished inventor based in Dresden, Germany, has made significant contributions to the field of semiconductor technology. With a patent dedicated to enhancing the precision of overlay errors in semiconductor fabrication, Thielscher plays a pivotal role at Infineon Technologies AG.

Latest Patents

Thielscher holds a patent titled "Method for reducing an overlay error and measurement mark for carrying out the same." This innovative method addresses the challenges associated with overlay errors of structures in patterned layers relative to reference layers. By forming standard measurement marks in both layers, Thielscher's method provides a means to identify and correct overlay errors as well as optical imaging errors in projection systems. This advancement is vital for improving the accuracy of circuit patterns on semiconductor substrates.

Career Highlights

Thielscher’s work at Infineon Technologies AG has positioned him as a key player in semiconductor research and development. His patent reflects a deep understanding of the technical challenges faced in the industry and demonstrates his commitment to advancing technology through innovation.

Collaborations

Thielscher collaborates closely with esteemed colleagues such as Stefan Gruss and Detlef Hofmann. Together, they work towards achieving technological breakthroughs that enhance the functionality and efficiency of semiconductor systems. Their teamwork exemplifies the importance of collaboration in driving innovation within the industry.

Conclusion

Guido Thielscher's contributions to semiconductor technology, highlighted by his innovative patent, underscore his role as an influential inventor in the field. His work at Infineon Technologies AG, along with his collaborations, continues to push the boundaries of what is possible in semiconductor fabrication, making significant strides toward the future of technology.

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