This inventor holds 2 USPTO granted patents. Top assignee: Stats Chippac Pte. Ltd.. Active years: 2010-2015.
Location History:
- Kyunggi-do, KR (2010)
- Kyounggi-do, KR (2015)
Company Filing History:
Years Active: 2010-2015
Title: Innovations of GuiChea Na in Semiconductor Technology
Introduction
GuiChea Na is a notable inventor based in Kyounggi-do, South Korea. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative approach to electronic packaging.
Latest Patents
One of his latest patents is titled "Flip chip interconnection structure with bump on partial pad and method thereof." This invention involves a semiconductor package that includes a semiconductor die with multiple solder bumps formed on bump pads. The substrate features a variety of contact pads, each with an exposed sidewall. A solder resist is strategically placed over at least a portion of each contact pad. The solder bumps are reflowed to create a metallurgical and electrical connection to the contact pads. Each contact pad is designed according to a specific rule that incorporates factors such as solder resist opening and solder registration. The design allows for flexibility in the shape of the contact pad, which can be circular, rectangular, or donut-shaped.
Career Highlights
GuiChea Na is currently employed at Stats Chippac Pte. Ltd., where he continues to develop innovative solutions in semiconductor packaging. His work has been instrumental in advancing the efficiency and reliability of electronic components.
Collaborations
Throughout his career, GuiChea Na has collaborated with talented individuals such as TaeKeun Lee and Rajendra D Pendse. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.
Conclusion
GuiChea Na's contributions to semiconductor technology reflect his dedication to innovation and excellence. His patents not only enhance the functionality of electronic devices but also pave the way for future advancements in the industry.