Guh Hwan Lim

Title: Guh Hwan Lim: Innovator in Printed Circuit Board Technology

Introduction

Guh Hwan Lim is a notable inventor based in Suwon-si, South Korea. He has made significant contributions to the field of printed circuit board technology, holding two patents that showcase his innovative approach to design and manufacturing.

Latest Patents

His latest patents include a printed circuit board and a method for manufacturing the same. The first patent describes a printed circuit board that features a first insulating layer with a through cavity, where the length between the side surfaces of the cavity exceeds the thickness of the insulating layer. This design includes recesses located at the upper and lower edges of the cavity's side surface. The second patent outlines a printed circuit board that consists of a first insulating material and a second insulating material on one surface of the first. This board includes first and second cavities with varying depths, and at least one groove portion is present in the side surfaces of these cavities.

Career Highlights

Guh Hwan Lim is currently employed at Samsung Electro-Mechanics Co., Ltd., where he continues to develop innovative solutions in the electronics sector. His work has contributed to advancements in printed circuit board technology, which is essential for modern electronic devices.

Collaborations

He has collaborated with notable coworkers such as Chi Seong Kim and Won Seok Lee, further enhancing the innovative environment at Samsung Electro-Mechanics Co., Ltd.

Conclusion

Guh Hwan Lim's contributions to printed circuit board technology reflect his dedication to innovation and excellence in the field. His patents demonstrate a commitment to advancing electronic design, making him a significant figure in the industry.