The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2024
Filed:
Mar. 10, 2022
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Chi Seong Kim, Suwon-si, KR;
Won Seok Lee, Suwon-si, KR;
Guh Hwan Lim, Suwon-si, KR;
Jin Uk Lee, Suwon-si, KR;
Jin Oh Park, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01L 23/13 (2006.01); H01L 23/66 (2006.01); H05B 45/20 (2020.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/119 (2013.01); H05K 1/183 (2013.01); H05K 3/0035 (2013.01); H05K 3/0038 (2013.01); H05K 3/0044 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/09854 (2013.01);
Abstract
A printed circuit board includes: a first insulating material; and a second insulating material disposed on one surface of the first insulating material, and including first and second cavities having depths different from each other. At least one groove portion is disposed in a side surface of each of the first and second cavities.
Kim, Chi. (2024). Printed circuit board (U.S. Patent No. 11903129). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11903129
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile