Location History:
- Saal/Do., DE (2017)
- Saal, DE (2020)
Company Filing History:
Years Active: 2017-2020
Title: Guenter Tutsch: Innovator in Chip Packaging Technology
Introduction
Guenter Tutsch is a notable inventor based in Saal, Germany. He has made significant contributions to the field of chip packaging technology, holding two patents that showcase his innovative approach to electronic components.
Latest Patents
His latest patents include a "Chip package with cross-linked thermoplastic dielectric," which discloses a package and method of manufacturing a package. In this example, the package comprises an electronic chip and a dielectric structure made from a highly filled cross-linked thermoplastic material. Another patent, titled "Chip packages and methods for manufacturing a chip package," provides a method for manufacturing a chip package. This method involves holding a carrier with multiple dies, forming a separation between the dies by removing portions of the carrier, and creating an encapsulation material in the removed portions.
Career Highlights
Guenter Tutsch is associated with Infineon Technologies AG, a leading company in semiconductor solutions. His work has contributed to advancements in the efficiency and reliability of chip packaging.
Collaborations
Some of his coworkers include Joachim Mahler and Georg Meyer-Berg, who have collaborated with him on various projects within the company.
Conclusion
Guenter Tutsch's innovative patents and contributions to chip packaging technology highlight his role as a significant inventor in the electronics industry. His work continues to influence advancements in semiconductor technology.