The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2017
Filed:
May. 25, 2012
Karl Adolf Dieter Mayer, Villach, AT;
Guenter Tutsch, Saal/Do., DE;
Horst Theuss, Wenzenbach, DE;
Manfred Engelhardt, Villach-Landskron, AT;
Joachim Mahler, Regensburg, DE;
Karl Adolf Dieter Mayer, Villach, AT;
Guenter Tutsch, Saal/Do., DE;
Horst Theuss, Wenzenbach, DE;
Manfred Engelhardt, Villach-Landskron, AT;
Joachim Mahler, Regensburg, DE;
INFINEON TECHNOLOGIES AG, Neubiberg, DE;
Abstract
A method for manufacturing a chip package is provided. The method including: holding a carrier including a plurality of dies; forming a separation between the plurality of dies by removing from the carrier one or more portions of the carrier between the plurality of dies; forming an encapsulation material in the removed one or more portions between the plurality of dies; separating the dies through the encapsulation material.