Infineon Technologies Ag

Guenter Tutsch

Joachim Mahler

Horst Theuss

Georg Meyer-Berg

Manfred Engelhardt

Karl Adolf Dieter Mayer

A package and method of manufacturing a package is disclosed. In one example, the package includes an electronic chip and a dielectric structure comprising a highly filled cross-linked thermoplastic material.

Chip package with cross-linked thermoplastic dielectric

A method for manufacturing a chip package is provided. The method including: holding a carrier including a plurality of dies; forming a separation between the plurality of dies by removing from the carrier one or more portions of the carrier between the plurality of dies; forming an encapsulation material in the removed one or more portions between the plurality of dies; separating the dies through the encapsulation material.

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Saal, Germany

Guenter Tutsch