Guanhua Hou

Title: Guanhua Hou: Innovator in Polishing Pad Technology

Introduction

Guanhua Hou is a notable inventor based in Mullica Hill, NJ (US). He has made significant contributions to the field of polishing pad technology, particularly for integrated circuit wafers. With a total of 2 patents, his innovations are paving the way for advancements in semiconductor manufacturing.

Latest Patents

One of his latest patents is titled "Polishing pad with multipurpose composite window." This invention provides a polishing pad suitable for polishing integrated circuit wafers. It features an upper polishing layer with a polishing surface and at least one groove. A transparent window is integrated within the upper layer, allowing for precise measurement of groove depth through the activation of a fluorescent transparent polymer. This innovation enhances endpoint detection during the polishing process.

Another significant patent is "Polishing pad with pad wear indicator." This invention also targets the polishing of integrated circuit wafers. It includes a polyurethane polishing layer with a top surface and grooves. A copolymer wear detector is embedded within the polishing layer to monitor wear adjacent to the grooves. This wear detector consists of two regions, one being a fluorescent acrylate/urethane copolymer and the other a non-fluorescent region, enabling effective wear detection.

Career Highlights

Guanhua Hou is currently associated with Rohm and Haas Electronic Materials CMP Holdings, Inc. His work at this company has been instrumental in developing innovative solutions for the semiconductor industry. His expertise in polishing pad technology has positioned him as a key player in this specialized field.

Collaborations

Guanhua has collaborated with notable coworkers such as Matthew R. Gadinski and Mauricio E. Guzman. Their combined efforts have contributed to the advancement of technologies in the semiconductor manufacturing sector.

Conclusion

Guanhua Hou's contributions to polishing pad technology demonstrate his commitment to innovation in the semiconductor industry. His patents reflect a deep understanding of the challenges faced in wafer polishing and offer practical solutions to enhance manufacturing processes.