Rohm and Haas Electronic Materials Cmp Holdings, Inc.

Guanhua Hou

Matthew R Gadinski

Mauricio E Guzman

Nestor A Vasquez

The invention provides a polishing pad suitable for polishing integrated circuit wafers. It includes an upper polishing layer that having a polishing surface and at least one groove in the upper polishing layer. At least one transparent window is located within the upper layer. The at least one transparent window has a thickness greater than a desired wear depth of the at least one groove. The at least one transparent window includes a non-fluorescent transparent polymer; and a fluorescent transparent polymer. The transparent window allows measuring groove depth by activating the fluorescent transparent polymer with an activation source at a wavelength sufficient to excite the fluorescent transparent polymer and allow endpoint detection by sending light through the fluorescent transparent polymer and the non-fluorescent transparent polymer.

Polishing pad with multipurpose composite window

The invention provides a polishing pad suitable for polishing integrated circuit wafers. A polyurethane polishing layer has a top surface and at least one groove in the polyurethane polishing layer. At least one copolymer wear detector located within the polyurethane polishing layer detects wear of the polishing layer adjacent the at least one groove. The at least one wear detector includes two regions, a first region being a fluorescent acrylate/urethane copolymer linked with a UV curable linking group and a second non-fluorescent region, The wear detector allows detecting wear of the polishing layer.

Growing community of inventors

Mullica Hill, NJ, United States of America

Guanhua Hou