Guan-Hua Lu

Title: Innovations of Guan-Hua Lu

Introduction

Guan-Hua Lu is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic packaging, holding a total of 2 patents. His work focuses on improving manufacturing processes and enhancing the efficiency of electronic components.

Latest Patents

One of Guan-Hua Lu's latest patents is titled "Carrying substrate, electronic package having the carrying substrate, and methods for manufacturing the same." This patent describes a method of manufacturing a carrying substrate where at least one circuit component is disposed on a first circuit structure. An encapsulation layer is formed on the first circuit structure, encapsulating the circuit component. A second circuit structure is then formed on the encapsulation layer and is electrically connected to the circuit component. This innovative approach allows the circuit component to be embedded in the encapsulation layer via an existing packaging process, increasing the routing area and ensuring that a large-sized package substrate has a high yield and low manufacturing cost.

Career Highlights

Guan-Hua Lu is currently employed at Siliconware Precision Industries Co., Ltd., a leading company in the semiconductor packaging industry. His expertise in electronic packaging has positioned him as a valuable asset to the company, contributing to advancements in technology and manufacturing processes.

Collaborations

Guan-Hua Lu has collaborated with several talented individuals in his field, including Chi-Ching Ho and Bo-Hao Ma. These collaborations have fostered innovation and have led to the development of cutting-edge technologies in electronic packaging.

Conclusion

Guan-Hua Lu's contributions to the field of electronic packaging through his patents and collaborations highlight his role as an influential inventor. His work continues to impact the industry positively, paving the way for future innovations.