Gregory C Desalvo

Title: Innovator Spotlight: Gregory C Desalvo

Introduction:

Gregory C Desalvo, a talented inventor based in Bellbrook, OH, has made significant contributions to the field of semiconductor technology. With a total of two patents to his name, Desalvo's innovative work has revolutionized wafer thinning techniques and via-hole fabrication processes.

Latest Patents:

1. Stiffened backside fabrication for microwave radio frequency wafers: Desalvo's patent introduces an etching-based semiconductor wafer thinning arrangement that enhances the structural integrity of thinned wafers. By incorporating a grid array of original wafer thickness semiconductor material, this innovation improves strength and rigidity, offering advantages over conventional thinning methods. The technology is suitable for use with gallium arsenide and other semiconductor materials, making it ideal for radio frequency and integrated circuit applications.

2. Measured via-hole etching: Desalvo's second patent focuses on an integrated circuit substrate via-hole fabrication arrangement that allows for precise determination of via-hole size and registration. By using a calibrated pattern during the circuit fabrication process, this invention ensures accuracy in via-hole fabrication. Particularly valuable for gigahertz radio frequency-capable integrated circuits with ground conductor-connected via conductors, this technology enhances overall performance.

Career Highlights:

Desalvo is currently affiliated with the United States of America – as Represented by the Secretary of the Air Force, where his groundbreaking research and innovations have garnered recognition. His commitment to advancing semiconductor technologies underscores his dedication to excellence in the field.

Collaborations:

In his professional journey, Desalvo has had the privilege of collaborating with accomplished individuals in the industry. Notable coworkers include Tony K Quach and John L Ebel, who have contributed to the success of joint projects and initiatives, further solidifying Desalvo's reputation as a collaborative innovator.

Conclusion:

Gregory C Desalvo's inventive spirit and remarkable contributions to semiconductor technology have positioned him as a key figure in the industry. Through his patented technologies and collaborative efforts, Desalvo continues to drive innovation and push the boundaries of what is possible in the field of semiconductor research and development.