Gregory A Carlson

Title: Gregory A. Carlson: Innovator in Wafer Level Packaging Technologies

Introduction

Gregory A. Carlson is a prominent inventor based in Goleta, California. He has made significant contributions to the field of wafer level packaging, particularly in the development of technologies for microbolometer vacuum package assemblies and infrared camera detectors. With a total of 5 patents, Carlson's work has advanced the capabilities of infrared imaging systems.

Latest Patents

One of Carlson's latest patents is focused on the wafer level packaging of microbolometer vacuum package assemblies. This innovative apparatus includes a wafer alignment and bonding chamber, bolometer wafer chuck, and lid wafer chuck, all designed to create an ultra-high vacuum environment. The system allows for independent heating and cooling of the chucks, as well as precise movement and alignment of wafers.

Another notable patent involves the wafer level packaging of infrared camera detectors. This invention features a substrate with an array of infrared detectors and a readout integrated circuit. A transparent window is positioned above the array, creating a sealed cavity that enhances the performance of infrared cameras.

Career Highlights

Gregory A. Carlson is currently employed at FLIR Systems, Incorporated, where he continues to innovate in the field of infrared technology. His work has been instrumental in developing advanced imaging solutions that are widely used in various applications.

Collaborations

Carlson has collaborated with notable colleagues such as Paul Schweikert and Andrew Sharpe, contributing to the advancement of technologies in their field.

Conclusion

Gregory A. Carlson's contributions to wafer level packaging and infrared technology have established him as a key figure in the industry. His innovative patents and ongoing work at FLIR Systems, Incorporated continue to shape the future of infrared imaging.