The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 25, 2018

Filed:

Dec. 05, 2016
Applicant:

Flir Systems, Inc., Wilsonville, OR (US);

Inventors:

Gregory A. Carlson, Goleta, CA (US);

Alex Matson, Goleta, CA (US);

Andrew Sharpe, Solvang, CA (US);

Davey Beard, Santa Barbara, CA (US);

Paul Schweikert, Ventura, CA (US);

Robert Simes, Santa Barbara, CA (US);

Assignee:

FLIR Systems, Inc., Wilsonville, OR (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01J 5/20 (2006.01); G01J 5/04 (2006.01); H04N 5/225 (2006.01); H04N 5/33 (2006.01); G01J 5/02 (2006.01); G01J 1/02 (2006.01); G01J 1/44 (2006.01); G01J 5/10 (2006.01); H01L 27/146 (2006.01); H01L 21/66 (2006.01); H01L 37/02 (2006.01); G01J 5/00 (2006.01);
U.S. Cl.
CPC ...
G01J 5/20 (2013.01); G01J 1/0204 (2013.01); G01J 1/44 (2013.01); G01J 5/02 (2013.01); G01J 5/023 (2013.01); G01J 5/0215 (2013.01); G01J 5/046 (2013.01); G01J 5/10 (2013.01); H01L 22/14 (2013.01); H01L 22/32 (2013.01); H01L 27/146 (2013.01); H01L 27/1462 (2013.01); H01L 27/14618 (2013.01); H01L 27/14632 (2013.01); H01L 27/14636 (2013.01); H01L 27/14669 (2013.01); H01L 27/14687 (2013.01); H01L 27/14698 (2013.01); H01L 37/02 (2013.01); H04N 5/2251 (2013.01); H04N 5/33 (2013.01); G01J 2005/0077 (2013.01); G01J 2005/204 (2013.01); Y10T 29/49826 (2015.01);
Abstract

An infrared detector useful in, e.g., infrared cameras, includes a substrate having an array of infrared detectors and a readout integrated circuit interconnected with the array disposed on an upper surface thereof, for one or more embodiments. A generally planar window is spaced above the array, the window being substantially transparent to infrared light. A mesa is bonded to the window. The mesa has closed marginal side walls disposed between an outer periphery of a lower surface of the window and an outer periphery of the upper surface of the substrate and defines a closed cavity between the window and the array that encloses the array. A solder seal bonds the mesa to the substrate so as to seal the cavity.


Find Patent Forward Citations

Loading…