This inventor holds 5 USPTO granted patents. Top assignees: Nitto Electric Industrial Co., Ltd., Nitto Electrical Industrial, Nitto-Denko Corporation. Active years: 1992-2000.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
3 out of 172 
1 out of 1 
1 out of 3,949 
Years Active: 1992-2000
Title: Innovations by Gosei Uemura: Pioneering Semiconductor Solutions
Introduction: Gosei Uemura, an accomplished inventor based in Osaka, Japan, has made significant contributions to the field of semiconductor technology. With a portfolio of five patents, Uemura has focused his efforts on developing innovative materials and processes that enhance the efficiency of semiconductor wafer processing.
Latest Patents: Among his latest inventions, Uemura has developed a thin adhesive sheet specifically designed for working with semiconductor wafers. This adhesive sheet consists of a light-permeable support and a unique pressure-sensitive adhesive layer. The composition of the adhesive layer includes 100 parts by weight of a base polymer, alongside a low molecular weight compound with at least two photopolymerizable carbon-carbon double bonds, and a photopolymerization initiator. This innovative adhesive sheet is designed to firmly bond to semiconductor wafers during the cutting process while significantly reducing the adhesive force, making the pick-up operation more efficient and user-friendly. This invention proves to be extremely useful in semiconductor wafer processing.
Career Highlights: Uemura’s career features significant affiliations with leading companies in the semiconductor industry, including Nitto Electric Industrial Co., Ltd. and Nitto Denko Corporation. These experiences have undoubtedly contributed to his understanding of the market needs and technological advancements, allowing him to create valuable inventions.
Collaborations: Throughout his career, Uemura has collaborated with notable individuals such as Yoshinari Satoda and Eiji Shigemura. These partnerships have fostered a creative environment leading to the development of groundbreaking technologies in the semiconductor field.
Conclusion: Gosei Uemura's innovative contributions to semiconductor technology, particularly through his patent for the thin adhesive sheet, highlight his role as a pioneer in the industry. His work not only showcases his inventive spirit but also reflects the importance of collaboration in the advancement of technology. Uemura’s inventions are poised to make a lasting impact on the semiconductor manufacturing process, enhancing efficiency and effectiveness in the field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile