The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 04, 2000
Filed:
Sep. 19, 1997
Nitto Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A thin adhesive sheet for working semiconductor wafers is described, comprising a light-permeable support and a pressure-sensitive adhesive layer on the support, wherein the adhesive layer is a composition comprising 100 parts by weight of a base polymer, from 1 to 100 parts by weight of a low molecular weight compound containing at least two photopolymerizable carbon--carbon double bonds in the molecule, and from 0.1 to 5 parts by weight of a photopolymerization initiator. This adhesive sheet is firmly bonded to a semiconductor wafer during the wafer cutting process, the adhesive force of the adhesive sheet is markedly reduced. As a result, the pick-up operation can be carried out easily. This adhesive sheet is useful in working semiconductor wafers.