Company Filing History:
3 out of 172 
1 out of 3,872 
Years Active: 1993-2000
Title: Eiji Shigemura: Innovator in Semiconductor Technology
Introduction
Eiji Shigemura is a notable inventor based in Osaka, Japan, recognized for his contributions to semiconductor technology. He holds a total of four patents, showcasing his innovative approach to enhancing semiconductor wafer processing.
Latest Patents
Shigemura's latest patents include a thin adhesive sheet designed for working with semiconductor wafers. This adhesive sheet features a light-permeable support and a pressure-sensitive adhesive layer. The adhesive layer is composed of 100 parts by weight of a base polymer, along with 1 to 100 parts by weight of a low molecular weight compound that contains at least two photopolymerizable carbon-carbon double bonds. Additionally, it includes 0.1 to 5 parts by weight of a photopolymerization initiator. This innovative adhesive sheet is firmly bonded to a semiconductor wafer during the cutting process, significantly reducing the adhesive force and facilitating an easier pick-up operation. This technology proves to be highly useful in the semiconductor wafer working process.
Career Highlights
Throughout his career, Eiji Shigemura has worked with prominent companies such as Nitto Electric Industrial Co., Ltd. and Nitto Denko Corporation. His experience in these organizations has contributed to his expertise in semiconductor technologies and innovations.
Collaborations
Shigemura has collaborated with notable coworkers, including Gosei Uemura and Yoshinari Satoda, further enhancing his contributions to the field of semiconductor technology.
Conclusion
Eiji Shigemura's innovative work in developing adhesive sheets for semiconductor wafers highlights his significant impact on the industry. His patents and collaborations reflect his dedication to advancing semiconductor technology.